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Grinding induced subsurface cracks in silicon wafersInternational Journal of Machine Tools Manufacture 39 (1999) 1103–1116 Grinding induced subsurface cracks in silicon wafers Z.J. Pei*, S.R. Billingsley, S. Miura
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silicon growing - Silfexsilicon growing. Low-volume, high-mix custom production of large diameter (up to 460mm) single and multi-crystal silicon is supported with Silfex's in-house crystal ...
Patent CN102490107A - Automatic mechanical hand for ...The invention relates to an automatic mechanical hand for a silicon ingot surface grinding machine. The automatic mechanical hand comprises a machine body …
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Patent US9242333 - Systems and methods for ingot grinding ...A method of grinding an ingot for use in manufacturing ... Try the new Google Patents, with machine-classified ... The silicon ingot is then machined into a desired ...
Surface Grinding in Silicon Wafer Manufacturingsilicon ingot into wafers of thin disk shape; Edge ... surface grinding in silicon wafer manufacturing --wire- ... Japan) and GN surface ...
custom silicon ingots blanks - Silfexcustom silicon ingots blanks. Low-volume, high-mix custom production of single and multi-crystal silicon is supported with Silfex's in-house crystal growing ...
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